Intel to debut faster Centrino in 2006

The new Centrino will feature a dual-core chip that is 31 percent smaller than previous chips.

Intel will release the third generation of its Centrino mobile technology solution in the first half of 2006, company officials said today.

Code-named “Napa,” the new Centrino will feature a dual-core chip that is 31 percent smaller than the chips Intel used three years ago, said Anand Chandrasekher, Intel’s vice president and director of the sales and marketing group.

Chandrasekher spoke to a packed audience at the itsGov Technology Showcase in Washington, D.C. FCW Media Group, which includes Federal Computer Week and FCW.com, and itsGov have the same corporate owners.

Introduced in 2003, Centrino maximizes battery life and mobility by bringing together wireless network functions, a smaller processor and related chipsets.


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